Difference between revisions of "Game Boy Naming Convention"

From Tauwasser's Wiki
Jump to: navigation, search
(Copied contents from http://gbdev.gg8.se)
 
(some changes and additions thanks to Gekkio)
 
(3 intermediate revisions by the same user not shown)
Line 1: Line 1:
== DMG PCB Naming Convention ==
+
= DMG PCB Naming Convention =
  
 
DMG PCB codes follow the following convention:
 
DMG PCB codes follow the following convention:
Line 9: Line 9:
 
       \--------------------- one or two-letter optional part
 
       \--------------------- one or two-letter optional part
  
=== Descriptor Codes ===
+
== Descriptor Codes ==
  
 
{| class="wikitable sortable"
 
{| class="wikitable sortable"
Line 33: Line 33:
 
| B
 
| B
 
| MBC1A/MBC1B/MBC1B1
 
| MBC1A/MBC1B/MBC1B1
| 512kbit?
+
| 512kbit
 
| -?
 
| -?
 
| -
 
| -
Line 41: Line 41:
 
| 1Mbit
 
| 1Mbit
 
| 64kbit
 
| 64kbit
| Chip-on-Board
+
| COB
 
|-
 
|-
 
| D
 
| D
 
| MBC1A/MBC1B/MBC1B1 + CR1616
 
| MBC1A/MBC1B/MBC1B1 + CR1616
| 2Mbit?
+
| 2Mbit
 
| 256kbit
 
| 256kbit
 
| -
 
| -
Line 74: Line 74:
 
|-
 
|-
 
| K
 
| K
| MBC3A/MBC3B + CR2025
+
| MBC3/MBC3A/MBC3B w/ X + CR2025
 +
| -
 +
| -
 +
| -
 +
|-
 +
| L
 +
| MBC3/MBC3A/MBC3B w/o X + CR2025
 
| -
 
| -
 
| -
 
| -
Line 80: Line 86:
 
|-
 
|-
 
| M
 
| M
| MBC30 + CR2025
+
| MBC30 w/ X + CR2025
 
| -
 
| -
 
| -
 
| -
Line 89: Line 95:
 
| -
 
| -
 
| -
 
| -
| SOIC (narrow)
+
| SOP
 
|-
 
|-
 
| P
 
| P
Line 104: Line 110:
 
|-
 
|-
 
| T
 
| T
| HuC1A + CR1616
+
| HuC1/HuC1A + CR1616
 
| -
 
| -
 
| -
 
| -
| TSSOP
+
| TSOP I
 
|-
 
|-
 
| U
 
| U
Line 113: Line 119:
 
| -
 
| -
 
| -
 
| -
| TSOP
+
| TSOP II
 
|}
 
|}
  
Line 120: Line 126:
 
* 256kbit of ROM
 
* 256kbit of ROM
 
* no SRAM
 
* no SRAM
* ROM chip package is a narrow SOIC
+
* ROM chip package is a narrow SOIC (SOP)
  
=== PCB Revisions ===
+
ROM and RAM sizes are maximum sizes, i.e. smaller memories will alias, while bigger memories will be inaccessible past the stated size.
 +
 
 +
== PCB Revisions ==
  
 
Numbers include
 
Numbers include
Line 130: Line 138:
 
*03
 
*03
 
*10
 
*10
 +
*20
 +
*SP
  
Mostly minor routing differences if any. Sometimes additional components in 10. Never additional components in 0x?
+
Mostly minor routing differences if any. Sometimes additional components in 10, 20, SP.
 +
First figure is major revision -- i.e. additional components, bigger changes -- while second figure is minor changes in masks only.
  
=== Optional Parts ===
+
== Optional Parts ==
  
DMG-MC-SFCN-01 Momotarou Collection 2
+
* DMG-MC-SFCN-01 Momotarou Collection 2
DMG-M-PEAN-10 Taito Variety Pack
+
* DMG-M-PEAN-10 Taito Variety Pack
  
 
MC = Momotarou Collection? MultiCart?
 
MC = Momotarou Collection? MultiCart?
Line 142: Line 153:
 
Code in parentheses after descriptor is only ever K.
 
Code in parentheses after descriptor is only ever K.
  
DMG-BEAN(K)-10 Xenon 2
+
* DMG-BEAN(K)-10 Xenon 2
DMG-DECN(K)-02 Mogurania (Mole Mania)
+
* DMG-DECN(K)-02 Mogurania (Mole Mania)
  
 +
Working hypothesis: PCBs were made in Korea and to track failure rates, marked with (K)?
  
== CGB PCB Naming Convention ==
+
= CGB PCB Naming Convention =
  
 
CGB PCB codes follow the following convention:
 
CGB PCB codes follow the following convention:
Line 152: Line 164:
 
  DMG-?NN-NN
 
  DMG-?NN-NN
 
     |||  \-- PCB revision
 
     |||  \-- PCB revision
     ||\----- PCB descriptor MBC
+
     ||\----- PCB descriptor RAM/ROM size combination
     |\------ PCB descriptor RAM/ROM size combination
+
     |\------ PCB descriptor MBC
 
     \------- PCB code
 
     \------- PCB code
  
=== PCB Code ===
+
== PCB Code ==
  
 
*A: Production Cartridges
 
*A: Production Cartridges
Line 162: Line 174:
 
*Z: Revisions of certain A?? variants. Sometimes routing changes.
 
*Z: Revisions of certain A?? variants. Sometimes routing changes.
  
=== PCB Descriptor ===
+
== PCB Descriptor ==
  
 
Descriptors describe MBC and ROM/RAM size combinations only.
 
Descriptors describe MBC and ROM/RAM size combinations only.
Line 228: Line 240:
 
Maybe actually hierarchy? I.e. second figure is sub-index in first figure MBC PCB designs?
 
Maybe actually hierarchy? I.e. second figure is sub-index in first figure MBC PCB designs?
  
=== PCB Revisions ===
+
== PCB Revisions ==
  
 
Numbers include
 
Numbers include
Line 236: Line 248:
  
 
Never observed any major differences. Maybe minor solder mask differences?
 
Never observed any major differences. Maybe minor solder mask differences?
 +
 +
[[Category:DMG]]

Latest revision as of 11:58, 30 May 2016

DMG PCB Naming Convention

DMG PCB codes follow the following convention:

DMG[-?[?]]-???[?][(?)]-NN
     |      |      |    \-- PCB revision
     |      |      \------- optional code in parentheses
     |      \-------------- mandatory three or four-letter descriptor
     \--------------------- one or two-letter optional part

Descriptor Codes

Code MBC/Battery ROM Size RAM Size ROM Package
(none) - - - QFP
A none 256kbit none -
B MBC1A/MBC1B/MBC1B1 512kbit -? -
C - 1Mbit 64kbit COB
D MBC1A/MBC1B/MBC1B1 + CR1616 2Mbit 256kbit -
E - 4Mbit 512kbit -
F - 8Mbit - -
G MBC2A + CR1616 16Mbit - -
H - 32Mbit - -
K MBC3/MBC3A/MBC3B w/ X + CR2025 - - -
L MBC3/MBC3A/MBC3B w/o X + CR2025 - - -
M MBC30 w/ X + CR2025 - - -
N - - - SOP
P MMM01 - - -
S MMM01 + CR1616 - - -
T HuC1/HuC1A + CR1616 - - TSOP I
U HuC3A + CR2025 - - TSOP II

For example, DMG-BEAN-02 is a PCB made for

  • MBC1A/MBC1B/MBC1B1 (without battery)
  • 256kbit of ROM
  • no SRAM
  • ROM chip package is a narrow SOIC (SOP)

ROM and RAM sizes are maximum sizes, i.e. smaller memories will alias, while bigger memories will be inaccessible past the stated size.

PCB Revisions

Numbers include

  • 01
  • 02
  • 03
  • 10
  • 20
  • SP

Mostly minor routing differences if any. Sometimes additional components in 10, 20, SP. First figure is major revision -- i.e. additional components, bigger changes -- while second figure is minor changes in masks only.

Optional Parts

  • DMG-MC-SFCN-01 Momotarou Collection 2
  • DMG-M-PEAN-10 Taito Variety Pack

MC = Momotarou Collection? MultiCart?

Code in parentheses after descriptor is only ever K.

  • DMG-BEAN(K)-10 Xenon 2
  • DMG-DECN(K)-02 Mogurania (Mole Mania)

Working hypothesis: PCBs were made in Korea and to track failure rates, marked with (K)?

CGB PCB Naming Convention

CGB PCB codes follow the following convention:

DMG-?NN-NN
    |||  \-- PCB revision
    ||\----- PCB descriptor RAM/ROM size combination
    |\------ PCB descriptor MBC
    \------- PCB code

PCB Code

  • A: Production Cartridges
  • B: Test Cartridges
  • Z: Revisions of certain A?? variants. Sometimes routing changes.

PCB Descriptor

Descriptors describe MBC and ROM/RAM size combinations only.

Number MBC RAM/ROM size combination
RAM sizes ROM sizes
0 MBC5 (w/ or w/o rumble) 4/8M 2/4k EEPROM or 1M SRAM
1 MBC5 (w/ rumble) 16/32/64M 64k
2 G-MMC1 (+ 8M FLASH) 2/4/8M 256k
3 MBC6 (+ 8M FLASH) 16/32/64M 256k
4 MBC7 4/8M -?
5 - -? -?
6 - 2/4/8M 64k
7 - 16/32M 2/4k EEPROM
8 - -? -?
9 - -? -?

Maybe actually hierarchy? I.e. second figure is sub-index in first figure MBC PCB designs?

PCB Revisions

Numbers include

  • 01
  • 10

Never observed any major differences. Maybe minor solder mask differences?